制程能力及检测参数
Process capability and checking parameters

序号
No.

ITEM

Technical capabilities

Illustration

PCB

Rigid-Flex PCB

FPC

1

层次
Layers

1-64 layers

2-30 layers

1-20 layers

2

最大尺寸
Max.Board Size

1200mm*610mm

1200mm*490mm

5000mm*490mm

3

板厚
Finished Board Thickness

0.15mm--10.0mm

0.15mm -10.0mm

0.06mm -1mm

4

铜厚
Copper Thickness

12um-420um

12um-210um

12um-105um

0.3OZ--12OZ

0.3OZ - 6OZ

0.3OZ - 3OZ

5

最小线宽/线距
Min.Trace Width/Space

0.05mm/0.05mm

0.05mm/0.05mm

0.035mm/ 0.045mm

2 mil /2 mil

2 mil /2 mil

1.4 mil /1.8 mil

6

最小孔径
Min.Drill hole size

0.1mm

0.1mm

0.07mm

4 mil

4 mil

2.8 mil

7

最小孔环
Min.Annular Ring

0.1mm

0.1mm

0.07mm

4 mil

4 mil

2.8 mil

8

PTH孔孔径差
Hole Dim.Tolerance(PTH)

±0.05mm

±0.05mm

±0.05mm

2 mil

2 mil

2 mil

9

NP TH孔孔径差
Hole Dim.Tolerance(NP TH)

±0.05mm

±0.05mm

±0.05mm

2 mil

2 mil

2 mil

10

孔位公差
Drill Location Tolerance

±0.05mm

±0.05mm

±0.05mm

2 mil

2 mil

2 mil

11

V-CUT角度
V-CUT Angle

∠20-90°

∠20-90°

/

12

最小V-CUT板厚
Min.V-CUT PCB Thickness

0.25mm

0.25mm

/

10 mil

10 mil

/

13

外型公差
CNC Routing Tolerance

±0.08mm

±0.08mm

±0.05mm

3.15 mil

3.15 mil

2 mil

14

最小盲/埋孔
Min.Blind/Buried Via

0.1mm

0.1mm

0.07mm

4 mil

4 mil

2.8 mil

15

塞孔
Plug HoleSize

0.15mm-0.5mm

0.15mm-0.5mm

/

6 mil- 20 mil

6 mil- 20 mil

/

16

最小BGA
Min.BGA PAD

0.2mm

0.2mm

0.2mm

8 mil

8 mil

8 mil

17

材质
Materials

FR4板(指定品牌物料：如建滔、生益、联茂、南亚、台光台耀等)、高频板、铁氟龙板、陶瓷板、罗杰斯板等等

FR 4(designated brand materials：such as KB， Sheng yi， IT EQ， NANYA， EMC， CENS and soon) ， high
frequency board， Teflon board， ceramic board， Rogers board and soon
PET, Polyimide, RA(Rolled Annealed Copper Foil),ED(Electrodeposited Copper Foil)

18

表面处理
Surface Finish

沉金/防氧化/镀金(软/硬)/喷锡/沉银沉锡/镀锡/碳油/金手指

immersion gold/OSP/plating Gold(soft/hard) /hotair leveling(HAS L) /immersion Silver/immersion
Tin/plating Tin/Carbon ink/Gold-finger

19

翘曲度
Warp&Twist

≤0.75%

20

通断测试
Electrical Test in a

50--300V

21

可焊性试验
Solderability Testing

245±5℃， 3sec Wetting area least 95%

22

热冲击试验
Thermal Cycling Testing

288±5℃， 10sec， 3 cycles

23

离子污染测试
Ionic Contamination  Testing

Pb， Hg， Cd， Cr(V) ， PBB， PBDE六项均小等于1000ppm

Pb， Hg， Cd， Cr(VI) ， PBB， PBDE six items are less than 1000ppm

24

附着力测试
Sold mask Adhesion le sting

260℃+/-5， 10S， 3 times

25

特殊工艺
Special Technology

半孔、高Tg板、混合压板、无卤素板、超薄超厚板、邦定、阻抗、蓝胶、碳油、电厚金、镍钯金、金手指、
盲锣、埋盲孔、沉头孔、树脂塞孔、软硬结合板、HDI等.